Vanilla Chai Spice Pudding

Vanilla Chai Spice Pudding

Vanilla Chai Spice Pudding

This recipe is part of my April Times Union story. Read it all here.
My mother taught me how to love and appreciate all tea. I have sweet memories of barely warm chamomile tea made the way I liked it: with plenty of milk and sugar, served by my mom. She would go all out and be super fancy with her silver tea set, and I’ve loved tea of all kinds and flavors ever since. Chai was a post-college discovery for me, and the blend of warm spices – cinnamon, anise, pepper and cloves – is particularly good when combined with sugar and cream. I’ve borrowed its flavors for scones and cookies in the past, and here, in a sweet and simple pudding. Pudding is quite easy to make and only requires stirring and a bit of attention. This recipe calls for a few bags, steeped in the hot milk. Stir in the cornstarch and sugar, then stir and stir until it thickens, and you’ve got creamy, warm pudding—the ultimate in comfort foods. Eat it warm from the pot, or portion it into little cups and top with berries and whipped cream. Doesn’t that sound like a nice dessert for any mom? 

Vanilla Chai Spice Pudding

Recipe by Caroline Barrett




  • 3 tablespoons cornstarch

  • 4 tablespoons turbinado or raw sugar

  • Pinch salt

  • 3 cups milk, divided

  • 2 chai tea bags

  • 1 teaspoon vanilla

  • For serving: whipped cream, fresh berries


  • Whisk together the cornstarch, sugar and salt. Slowly whisk in ½ cup milk. Pour the remaining milk into a heavy-bottomed saucepan, add the tea bags and turn the heat to medium low. Cook for about five minutes, until very hot and steeped with tea.
  • Remove the tea bags and stir in the cornstarch mixture. Whisk constantly for 10-15 minutes, or until the pudding is thick. Stir in the vanilla and cool.
  • Spoon into small serving cups, top with a bit of whipped cream and a berry or two.

One Comment

  1. Pingback: Celebrating Mom with Food and Time Together – Caroline Barrett

Leave a Comment

Your email address will not be published. Required fields are marked *